Process and structure of overlay offset measurement

ABSTRACT

A process of overlay offset measurement includes providing a substrate; forming a first pattern layer with a predetermined first pattern on the substrate; forming a first photoresist layer on the substrate and the first pattern layer; forming a second photoresist layer on the first photoresist layer; forming a second pattern layer with a predetermined second pattern on the second photoresist layer; patterning the second photoresist layer to form a trench having a predetermined third pattern being substantially aligned with the predetermined first pattern of the first pattern layer; and performing overlay offset measurement according to the second pattern layer and the trench.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional application of U.S. application Ser.No. 16/874,045, filed on May 14, 2020, the entire contents of which areherein expressly incorporated by reference.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention generally relates to overlay offset measurement,and more particularly to a semiconductor structure and process thatfacilitate overlay offset measurement.

2. Description of Related Art

As the critical dimension of a semiconductor device progressivelydecreases due to advancing technology, the tolerance to offset betweenlayers becomes lower. The alignment or overlay measurement betweenlayers may be measured by overlay measure tools.

However, as a layer of an electronic device, such as optoelectronicdevice, may have a thickness so large (e.g., greater than 14 μm) thatoverlay offset (or shift) measurement cannot be properly performed whilemanufacturing the electronic device.

A need has thus arisen to propose a novel scheme to overcome thedrawbacks of overlay offset measurement while manufacturing theelectronic device.

SUMMARY OF THE INVENTION

In view of the foregoing, it is an object of the embodiment of thepresent invention to provide a semiconductor structure and process thatfacilitate overlay offset (or shift) measurement.

According to one embodiment, a process and structure of overlay offsetmeasurement include a substrate, a first pattern layer, a firstphotoresist layer, a second photoresist layer and a second patternlayer. The first pattern layer with a predetermined first pattern isformed on the substrate. The first photoresist layer is formed on thesubstrate and the first pattern layer. The second photoresist layer isformed on the first photoresist layer, the second photoresist layerbeing patterned to form a trench having a predetermined third patternbeing substantially aligned with the predetermined first pattern of thefirst pattern layer. The second pattern layer with a predeterminedsecond pattern is formed on the second photoresist layer, overlay offsetmeasurement being performed according to the second pattern layer andthe trench.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A to FIG. 1D show cross-sectional views illustrating asemiconductor process that facilitates overlay offset measurement whilemanufacturing an electronic device according to one embodiment of thepresent invention;

FIG. 2A to FIG. 2C show corresponding top views of FIG. 1A to FIG. 1C;and

FIG. 3 shows a cross-sectional view illustrating an electronic device.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1A to FIG. 1D show cross-sectional views (e.g., on a cutting lineor path) illustrating a semiconductor process that facilitates overlayoffset (or shift or error) measurement while manufacturing an electronicdevice 100 according to one embodiment of the present invention, andFIG. 2A to FIG. 2C show corresponding top views of FIG. 1A to FIG. 1C.Although an optoelectronic device, such as fingerprint sensor, isexemplified in the embodiment, it is appreciated that the embodiment maybe generally adaptable to an electronic device that requires overlayoffset measurement to be performed while manufacturing the electronicdevice.

Referring to FIG. 1A (cross-sectional view) and FIG. 2A (top view), asubstrate (e.g., semiconductor wafer or glass) 11 is provided. Next, afirst pattern layer 12 with a predetermined first pattern acting as amark is formed on the substrate 11. In the embodiment, the first patternlayer 12 includes a first frame (i.e., the first pattern) having anopening (or hole) 121 therein.

Referring to FIG. 1B (cross-sectional view) and FIG. 2B (top view), afirst photoresist layer 13 is formed on the substrate 11 and the firstpattern layer 12, followed by forming a second photoresist layer 14 onthe first photoresist layer 13. The first photoresist layer 13 and thesecond photoresist layer 14 may have the same composition. In thespecification, a photoresist layer is a layer composed oflight-sensitive material used in processes, such as photolithography andphotoengraving, to form a patterned coating on a surface.

According to one aspect of the embodiment, the first photoresist layer13 has a (first) thickness being equal to or less than a predeterminedlimit (e.g., 14 μm) that overlay offset measurement (by overlay measuretools) can be properly performed, and the second photoresist layer 14has a (second) thickness being equal to or less than the predeterminedlimit. However, a total thickness of the second photoresist layer 14 andthe first photoresist layer 13 is greater than the predetermined limitthat overlay offset measurement can be properly performed.

Subsequently, still referring to FIG. 1B and FIG. 2B, a second patternlayer 15 with a predetermined second pattern acting as a mark is formedon the second photoresist layer 14. In the embodiment, the secondpattern layer 15 has a second frame (i.e., the second pattern).Particularly, the second frame of the second pattern layer 15 isdisposed within the opening 121 when looking down at the electronicdevice 100 from above. In other words, the second frame of the secondpattern layer 15 is disposed within the opening 121 of the first patternlayer 12.

Referring to FIG. 1C (cross-sectional view) and FIG. 2C (top view), thesecond photoresist layer 14 is subjected to patterning, such asphotoengraving, to form a trench 16 having a predetermined third patternacting as a mask. In the embodiment, the trench 16 (in the secondphotoresist layer 14) is substantially aligned, in vertical direction,with the predetermined first pattern of the first pattern layer 12.Further, the trench 16 has a third frame (i.e., the third pattern) suchthat the second pattern of the second pattern layer 15 is disposedwithin an inner periphery of the third frame of the trench 16.

According to the embodiment as disclosed above, the electronic device100 may then be subjected to overlay offset measurement according to thesecond pattern layer 15 and the trench 16 (in the second photoresistlayer 14). As the thickness of the second photoresist layer 14 is equalto or less than the predetermined limit (e.g., 14 μm) that overlayoffset measurement (by overlay measure tools) can be properly performed,the overlay offset among the first photoresist layer 13, the secondphotoresist layer 14 and the substrate 11 can therefore be properlymeasured.

Finally, referring to FIG. 1D (cross-sectional view), a lens 17 may beformed above the second photoresist layer 14 and the second patternlayer 15, thereby forming an optoelectronic device.

FIG. 3 shows a cross-sectional view illustrating an electronic device300, which includes a substrate 31, a first pattern layer 32, aphotoresist layer 33 and a second pattern layer 34. It is noted that theelectronic device 300 (FIG. 3 ) has only one photoresist layer 33instead of two photoresist layers (i.e., the first photoresist layer 13and the second photoresist layer 14) as in the electronic device 100(FIG. 1C). More importantly, the thickness of the photoresist layer 33of the electronic device 300 (FIG. 3 ) may probably be greater than thepredetermined limit (e.g., 14 μm) that overlay offset measurement can beproperly performed. Therefore, the overlay measurement between thephotoresist layer 33 and the substrate 31 cannot be properly performed.

To the contrary, overlay offset measurement may be properly performed onthe electronic device 100 (FIG. 1C) according to the second patternlayer 15 and the trench 16 (in the second photoresist layer 14) becausethe thickness of either the second photoresist layer 14 or the firstphotoresist layer 13 is less than the predetermined limit.

Although specific embodiments have been illustrated and described, itwill be appreciated by those skilled in the art that variousmodifications may be made without departing from the scope of thepresent invention, which is intended to be limited solely by theappended claims.

What is claimed is:
 1. A structure of overlay offset measurement,comprising: a substrate; a first pattern layer with a predeterminedfirst pattern formed on the substrate; a first photoresist layer formedon the substrate and the first pattern layer; a second photoresist layerformed on the first photoresist layer, the second photoresist layerbeing patterned to form a trench having a predetermined third patternbeing aligned with the predetermined first pattern of the first patternlayer; and a second pattern layer with a predetermined second patternformed on the second photoresist layer, overlay offset measurement beingperformed according to the second pattern of the second pattern layerand the third pattern of the trench.
 2. The structure of claim 1,wherein the first photoresist layer has a first thickness being equal toor less than a predetermined limit of the overlay offset measurement,and the second photoresist layer has a second thickness being equal toor less than the predetermined limit of the overlay offset measurement.3. The structure of claim 2, wherein a sum of the first thickness andthe second thickness is greater than the predetermined limit of theoverlay offset measurement.
 4. The structure of claim 1, wherein thefirst pattern comprises a first frame having an opening therein, thesecond pattern comprises a second frame, and the trench comprises athird frame.
 5. The structure of claim 4, wherein the second frame isdisposed within the opening of the first frame when looking down at thesecond frame from above.
 6. The structure of claim 4, wherein the secondpattern of the second pattern layer is disposed within an innerperiphery of the third frame of the trench.
 7. The structure of claim 1,wherein the second photoresist layer is patterned by photoengraving. 8.The structure of claim 1, further comprising: a lens formed above thesecond photoresist layer and the second pattern layer, thereby formingan optoelectronic device.